Bo on;Boron powder
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Molecular Structure
Detailed Description
Boron Powder
CAS No.:7440-42-8
EINECS No.:231-151-2
MF:B
Molecular Weight:10.81
Melting Point:2180
Boiling Point:3650
Inchi:InChI=1/B
Density:2.34 g/mL at 25(lit.)
Water-Solubility:H2O:soluble
Risk Codes:R11
UN number:UN3178 4
Safety instruction:S24/25
Package grade:III
Risk group:4.1
Uses:Used for silico mixture of semiconductor,heat-resisting material,hyperthermia high power semiconductor and additive of coating for metal.
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