| Product Name: |
tetraphenylsilane |
| CAS Registry Number: |
1048-08-4
|
| EINECS: |
213-881-3 |
| Synonyms: |
EINECS 213-881-3; NSC33014; AC1L24MW; ACMC-2098d7;Silane; tetraphenyl-; 1048-08-4; ANW-15113; Tetraphenylsilicon;tetraphenylsilane; |
| Molecular Structure: |
 |
| Molecular Formula: |
C24H20Si |
| Molecular Weight: |
336.5011 |
| Density: |
1.07 |
| Boiling Point: |
228℃ (3 torr) |
| Melting Point: |
236-7℃ |
| Flash Point: |
193°C |
| Refractive index: |
1.637 |
| Risk Codes: |
S22:Donotinhaledust.;S24/25:Avoidcontactwithskinandeyes.; |
| Safety Statements: |
| Safety Statements | 22-24/25 | | TSCA | Yes |
|
